MIL-C-50735 Circuit Card Assembly, 11737334 \(Logic\)This specification covers one type of electronic assembly known as Circuit Card Assembly: 11737334 \(Logic\) \(see 6.1\).

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MIL-C-50735(MU)

8 August 1973

3. 3.2 Environmental

3. 3.2.1 Storage temperature. The assembly shall meet the

requirements of 3.3.1 at ambient temperature after exposure to and

thermal stabilization at -80�F and +160�F.

3.3.2.2 Operating temperatures. The assembly shall meet the

requirements of 3.3.1 while exposed to and thermally stabilized at -40�F

and +125�F, subsequent to which the requirements of 3.3.1 shall be met

at ambient temperature .

3.3.2.3 Vibration. The assembly shall show no physical failure

and shall meet the requirements of 3.3.1 after being exposed to the

following vibratory conditions:

1 /64 inch, constant

Amplitude:

(1/32 inch double amplitude)

Vibratory

motion:

Simple harmonic

c. Sweep time:

5 to 55 to 5 Hertz in a five-

minute period

d. Vibration cycling:

Three linear or logarithmic

sweeps applied to each of the

three mutually perpendicular

axes.